Reflexion GT CMP Platform
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Technical characteristics
- BrandCMP
Description
As devices become more complex, incorporating a wider variety of materials and a growing number of film layers, demands on chemical-mechanical polishing (CMP) technology for enhanced removal uniformity, greater productivity, and lower costs continually expand. Future applications, such as 3D memory structures, will demand even greater removal control, while lower costs and higher productivity will be necessary if these new integration schemes are to be cost competitive.
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Reflexion GT CMP Platform
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