Modification of nanoparticles materials for new no lead solders PP116

PURPOSE AND SCOPE

New nanodispersed materials for lead - free solders based on the stannary Sn - Cu - Ag (SAC) with steel and non - metallic nanoparticles inclusions for use in the mode of step - by - step soldering in different temperature ranges have been created. They can be widely used in microelectronics, military and household appliances, jewelry and engineering industries

STATE OF INTELLECTUAL PROPERTY PROTECTION

Received a patent for the utility model

MARKET DEMAND

According to EU Directives banning the use of lead - based solders, enterprises of Ukraine as an associate member of the EU to introduce new soldering technologies using lead - free solders

ESSENCE OF THE DEVELOPMENT

Improved technology of producing of materials for lead - free solders in the form of thin ribbons with a thickness of  20 - 30 micrometers by the method of rapid quenching. The shape of such tapes is convenient for soldering wide areas with precisely defined size. It is important for connecting composites with metal matrices. The use of nanoparticles in the technology makes it possible to stabilize the structure of solder, which during crystallization will undergo significant modifications under external mechanical influences (electric and magnetic fields, temperature gradients, cooling rates, vibrations), prevent the formation of fatigue cracks and races, cycles, reduce grain, improve surface wetting

STATUS OF READINESS OF THE DEVELOPMENT

Methods and technological processes of the metal and ceramic nanoparticles implementation in materials for new lead - free solders based on the stannary are developed