CStack Board Connectors and Flex Assemblies

High-speed solderless interconnect solution provides limitless flexibility for board to board mezzanine applications and board to board stackable and coplanar applications when terminated to a flex circuit. 1mm - 5mm housing heights provide a solution for any application where space is tight and speed and reliability are required.

Features:

• High-speed assembly performance
• Very low profile interconnectiion
• Solderless, screw attach termination to circuit boards
• High density interconnections - to 127 lines per linear board inch (5 rows on 1mm (.03937 inch) centers)
• High reliability because of solderless interconnection
• Available in standard contact array sizes on both .050 (1.27mm) and 1mm (.03937 inch) centerlines
• Flex circuit can be mechanically and electrically customized to fit application specifications
• Standard hardware systems available

Signal Integrity:

• Combining low-cost termination with high-speed impedance controlled interconnection performance, the patented cStack stacking connector used to terminate these assemblies provides high signal integrity interconnection technology because of the connector's low (.048 inch) profile between flex and board. Flex circuitry for all cStack flex assemblies can be electrically and mechanically customized to exactly fit system specifications.